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Laser Drilled PCB | Microvia PCB Manufacturer | China 365PCB

Precision laser drilled PCBs for HDI, microvia, and fine-line circuit designs. Ideal for wearable tech, medical and aerospace applications.


Our laser drilled PCB solutions are designed to meet the demands of high-density, multilayer interconnect designs. Using CO₂ and UV laser drilling, we create microvias with pinpoint accuracy, enhancing signal performance and board reliability.


Keywords: laser drilled PCB, microvia board, HDI laser PCB, laser via drilling, laser hole PCB

Application Areas

• HDI Smartphones & Tablets

• Smart Watches & Wearables

• RF Modules & Antennas

• Medical Monitoring Devices

• Industrial IoT Sensors

Technical Capabilities & Certifications

• Laser Via Diameter: 0.1–0.15mm

• Drilling Tolerance: ±0.01mm

• Max Layers: 16+

• Blind/Buried Via Support

• AOI & X-ray via inspection

• Certifications: ISO 9001, UL, RoHS


Lead Time & MOQ

• Samples: 5 days

• Volume Orders: 10–12 days

• MOQ: 1 set


Customer Testimonials

“Their laser-drilled boards allow us to build truly compact RF modules with perfect alignment.” — Hideki S., Japan

“Reliable via quality and zero residue after laser—very satisfied with their microvia boards.” — Carlos D., Spain

FAQ

Q1: What type of laser is used for microvia drilling in your PCBs?

A: We use CO₂ lasers and UV lasers depending on the layer stack and material.


Q2: Do you support stacked microvias in laser drilled PCBs?

A: Yes, we manufacture stacked and staggered microvias for multilayer designs.


Q3: What is the typical hole-to-pad registration tolerance?

A: Our laser via positioning tolerance is within ±10μm.


Q4: Are laser-drilled PCBs RoHS compliant?

A: Yes, all our PCBs including laser-drilled variants meet RoHS and REACH compliance.


Q5: Can you combine mechanical and laser drilling in one board?

A: Absolutely. Hybrid drilling solutions are available for complex HDI structures.


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